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Origin of shallow hole traps at GaN/SiO2 interface studied from density functional theory

Yuansheng Zhao1,2,3,*, Atsushi Oshiyama1,4, and Kenji Shiraishi1,4

  • 1Institute of Materials and Systems for Sustainability, Nagoya University, Nagoya 464-8603, Japan
  • 2Quemix Inc., Chuo-ku, Tokyo 103-0027, Japan
  • 3Department of Physics, The University of Tokyo, Bunkyo-ku, Tokyo 113-0033, Japan
  • 4Center for Innovative Integrated Electronic Systems, Tohoku University, Sendai 980-8572, Japan

  • *Contact author: yszhao@g.ecc.u-tokyo.ac.jp

Phys. Rev. Materials 10, L091601 – Published 3 September, 2026

DOI: https://doi.org/10.1103/yn7x-9ldh

Abstract

We study the origin of interfacial shallow hole traps appearing in GaN-based metal oxide-semiconductor field-effect transistors (MOSFETs) using density-functional-theory calculations with realistic interfacial models. It is demonstrated that the GaOx interfacial layer spontaneously formed at the GaN/SiO2 interfaces, even without conventional point defects such as oxygen vacancies, induces hole traps. The holes are directly trapped at the tail state of amorphous GaOx, which are shown here to consist of 2p orbitals of low-coordinated O atoms with relatively high electrostatic potential. When occupied, these states are located just below the GaN valence band maximum, but upon hole localization, they are raised to the mid-gap region and become hole traps as a result of the lengthening of the Ga–O bonds.

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