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    Effects of alloying on in-plane thermal conductivity and thermal boundary conductance in transition metal dichalcogenide monolayers

    Cameron J. Foss and Zlatan Aksamija*

    • Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, Massachusetts 01003-9292, USA

    • *zlatana@umass.edu

    Phys. Rev. Materials 4, 124006 – Published 29 December, 2020

    DOI: https://doi.org/10.1103/PhysRevMaterials.4.124006

    Abstract

    Two-dimensional 1H transition metal dichalcogenides (TMDs) provide a platform, analogous to group IV cubic semiconductor alloys (Si1−xGe), that enables systematic investigations on the effects of alloying in 2D material systems. The existing literature on TMD alloys explores their electrical, magnetic, and optical properties, but lacks a comprehensive analysis of thermal transport in supported and nanostructured systems. Here we employ first-principles-driven phonon Boltzmann transport formalism and a 2D-3D thermal boundary conductance model to systematically study in-plane and cross-plane phonon transport of suspended and SiO2 supported single-layer TMD alloys. We find that the thermal conductivity of alloyed TMDs is dependent on system size up to tens of microns and that the combination of mass-difference and substrate scattering can significantly reduce thermal transport even in large systems (>500 nm). Beyond in-plane transport, we find that the thermal boundary conductance displays a qualitatively different trend and significantly weaker modulation with alloy composition as compared to the thermal conductivity. Our results help shed light on the in-plane and cross-plane thermal transport properties of 2D single-layer TMD alloys and further their applications in nanoelectronics, sensing, and energy devices.

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