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    Electrical stability of Cr2O3/β-Ga2O3 and NiOx/β-Ga2O3 heterojunction diodes

    Yizheng Liu*, Haochen Wang, Carl Peterson, Chinmoy Nath Saha, Chris G. Van de Walle, and Sriram Krishnamoorthy†

    • *Contact author: yizhengliu@ucsb.edu
    • †Contact author: sriramkrishnamoorthy@ucsb.edu

    Phys. Rev. Materials 10, 064605 – Published 22 June, 2026

    DOI: https://doi.org/10.1103/wscr-3vxz

    Abstract

    This work reports the electrical characteristics comparison study between Cr2O3 and NiOx based heterojunction diodes (HJD) on halide vapor phase epitaxy (HVPE) grown β-Ga2O3 epitaxial layers. Both as-fabricated Cr2O3 and NiOx HJDs exhibited forward current density in a range of 130–150 A/cm2 at 5 V with rectifying ratios >1010 and a reverse leakage current density at 10−8 A/cm2 at −5V. The differential specific on-resistance of Cr2O3 and NiOx HJDs was 12.01mΩcm2 and 12.05mΩcm2, respectively. Breakdown voltages of Cr2O3 HJDs ranged from 1.4–1.9 kV and 1.5–2.3 kV for NiOx HJDs. Theoretical band alignment between Cr2O3 and β-Ga2O3 was calculated from first principles. The ambient exposed NiOx/HVPE β-Ga2O3 HJDs’ forward current density degraded after 10 days while that of Cr2O3/HVPE β-Ga2O3 HJDs’ remained nearly unchanged after the same amount of time. It was later confirmed that the ambient exposed sputtered NiOx sheet resistance (Rsh) degradation gave rise to the reduction of the forward current density of the NiOx based HJDs, and water (H2O) was qualitatively determined to be the agent attributed to the forward conduction degradation by measuring the Rsh of NiOx-on-sapphire reference wafer after exposing it to different environments. The Cr2O3/HVPE β-Ga2O3 HJD also exhibited enhanced thermal stability compared to the NiOx/β-Ga2O3 heterostructures at elevated temperatures.

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