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    Nanomolding single crystalline CoIn3 and RhIn3 nanowires

    Nghiep Khoan Duong1, Christian D. Multunas2,3, Thomas Whoriskey4,5, Mehrdad T. Kiani6, Shanta R. Saha7, Stephen D. Funni6, Quynh P. Sam6, Han Wang6, Satya Kushwaha4,5 et al.

    Johnpierre Paglione7, Ravishankar Sundararaman2, and Judy J. Cha6

    Phys. Rev. Materials 9, 076005 – Published 29 July, 2025

    DOI: https://doi.org/10.1103/57rg-mxxh

    Abstract

    Intermetallic compounds containing transition metals and group III-V metals tend to possess strong correlations and high catalytic activities, both of which can be enhanced via reduced dimensionality. Nanostructuring is an effective approach to explore this possibility, yet the synthesis of nanostructured intermetallics is challenging due to vast differences in melting points and vapor pressures of the constituent elements. In this work, we demonstrate that this challenge can be overcome with thermomechanical nanomolding (TMNM), exemplified by the synthesis of intermetallic CoIn3 and RhIn3 nanowires. We show that TMNM successfully extrudes single-crystalline nanowires of these compounds down to the 20-nm diameter range, and the nanowires remain metallic with resistivity values higher than calculated bulk resistivity. We discuss possible effects of surface roughness scattering, vacancy-induced scattering, and surface oxidation, on the measured resistivities of the nanowires. For CoIn3 nanowires, the measured resistivity values are the first reported values for this compound.

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