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    First-principles study of CSiN and C2N monolayers with wide band gaps and ultrahigh thermal conductivities

    Zhao He1, Yi-Chi Li1, and Jian Zhou1,2,*

    • 1National Laboratory of Solid State Microstructures and Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China
    • 2Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China

    • *Contact author: zhoujian@nju.edu.cn

    Phys. Rev. B 111, 235423 – Published 11 June, 2025

    DOI: https://doi.org/10.1103/xr8q-372m

    Abstract

    Two-dimensional (2D) MoSi2N4 and its derivative materials have recently garnered significant attention due to their rich physical properties, including remarkable ambient stability, high carrier mobility, and exceptional thermal conductivity. In this study, we constructed a class of 2D sextuple-layer materials ABZ (A/B = C, Si, and Ge; Z = N, P, and As) based on the structure of MoSi2N4 and identified four stable structures through first-principles density functional theory (DFT) calculations. Due to their strong covalent bonds, CSiN and C2N monolayers are wide-band-gap semiconductors with band gaps of 3.42 and 5.32 eV, respectively, as determined by the hybrid DFT calculations. Notably, both materials exhibit ultrahigh lattice thermal conductivities, reaching 318 and 694 Wm−1K−1 at room temperatures, respectively. Our analysis attributes the ultrahigh lattice thermal conductivity to their large phonon group velocities and long phonon lifetimes arising from their strong covalent bonds. Additionally, we propose that CSiN and C2N could transition from their polar C3v phase to a metastable centrosymmetric D3d phase, with transition barriers of 0.89 and 0.70 eV per formula unit, respectively. In contrast, the C2P and Si2P monolayers exhibit smaller band gaps of 2.77 and 1.39 eV, respectively. This work highlights the potential of ultrahigh thermal conductivity semiconductors and provides valuable insights into designing advanced 2D materials for future applications.

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