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    Topological motifs governing superconductivity in pressure-stabilized Ti-Al intermetallics

    Yiming Wang1,2, Jia Qu1, Peng Jiang3, Vladislav A. Blatov4, Xuqiang Liu1, Yan-Ling Li3,*, and Wenge Yang1,†

    • *Contact author: ylli@jsnu.edu.cn
    • †Contact author: yangwg@hpstar.ac.cn

    Phys. Rev. B 114, 134501 – Published 1 September, 2026

    DOI: https://doi.org/10.1103/frhh-xd6p

    Abstract

    Record-high critical temperatures (Tc) of elemental superconductors have been rapidly updated under extreme pressures, yet typically only above the megabar regime. Preserving such high Tc at lower pressures remains a fundamental challenge. Here, we demonstrate that strategic alloying of Ti with controlled amounts of Al yields a family of Ti-Al intermetallics with ω-Ti-derived topological motifs that can be quenched to ambient pressure with substantially higher Tcs. In particular, Ti2Al reaches an ambient-pressure Tc of 12.6 K, more than 30 times that of pure Ti. This enhancement originates from motif-preserving substitution: at low Al content, Al acts like hole doping, shifting the Fermi level toward a high density-of-states region, whereas at higher Al content, the weakened interlayer Ti-Ti metallic bonding drives significant softening of three in-plane Ti phonon modes, leading to enhanced electron-phonon coupling. This substitution strategy, which retains a key structural framework while tuning carrier concentration and lattice dynamics, may provide a transferable design paradigm not only for superconductors but also for other functional materials whose properties are governed by specific topological motifs.

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