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Electrical transport properties of Ti-doped Fe2O3(0001) epitaxial films

B. Zhao1,2, T. C. Kaspar1,*, T. C. Droubay1, J. McCloy3, M. E. Bowden4, V. Shutthanandan4, S. M. Heald5, and S. A. Chambers1

  • 1Fundamental and Computational Sciences Directorate, Pacific Northwest National Laboratory, Richland, Washington 99352, USA
  • 2Department of Chemistry, University of Washington, Seattle, Washington 98195-1700, USA
  • 3Energy and Environment Directorate, Pacific Northwest National Laboratory, Richland, Washington 99352, USA
  • 4Environmental Molecular Sciences Laboratory, Pacific Northwest National Laboratory, Richland, Washington 99352, USA
  • 5Advanced Photon Source, Argonne National Laboratory, Argonne, Illinois 60439, USA

  • *tiffany.kaspar@pnnl.gov

Phys. Rev. B 84, 245325 – Published 30 December, 2011

DOI: https://doi.org/10.1103/PhysRevB.84.245325

Abstract

The electrical transport properties for compositionally and structurally well-defined epitaxial α-(TixFe1−x)2O3(0001) films have been investigated for x ≤ 0.09. All films were grown by oxygen plasma-assisted molecular beam epitaxy using two different growth rates: 0.05–0.06 Å/s and 0.22–0.24 Å/s. Despite no detectable difference in cation valence and structural properties, films grown at the lower rate were highly resistive whereas those grown at the higher rate were semiconducting (ρ = ∼1 Ω · cm at 25 °C). Hall effect measurements reveal carrier concentrations between 1019 and 1020 cm−3 at room temperature and mobilities in the range of 0.1 to 0.6 cm2/V · s for films grown at the higher rate. The conduction mechanism transitions from small-polaron hopping at higher temperatures to variable-range hopping at a transition temperature between 180 and 140 K. The absence of conductivity in the slow-grown films is attributed to donor electron compensation by cation vacancies, which may form to a greater extent at the lower rate because of higher oxygen fugacity at the growth front.

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