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    Significant tunneling electroresistance and ultralow resistance-area product in asymmetric In2S3/Cu2Se ferroelectric tunnel junctions

    Qingyan Li1,*, Lei Gao2,*,†, Yufei Xue1, Xi Geng1, Wuyi Gao1, and Jinming Cai1,‡

    • *These authors contributed equally to this work.
    • †Contact author: lgao@kust.edu.cn
    • ‡Contact author: j.cai@kust.edu.cn

    Phys. Rev. B 112, 245414 – Published 15 December, 2025

    DOI: https://doi.org/10.1103/6f3j-6zbm

    Abstract

    Conventional ferroelectric tunnel junctions (FTJs) face inherent limitations in simultaneously achieving both a high tunneling electroresistance ratio (TER) and a low resistance-area product (RAP), hindering high-density, low-power, nonvolatile memory applications. This study overcomes this challenge by designing asymmetric FTJs based on a two-dimensional In2S3/Cu2Se heterostructure. Utilizing first-principles calculations with quantum transport simulations, we demonstrate that ferroelectric polarization switching in In2S3 reversibly modulates the heterostructure's band alignment between type-III (metallic) and type-II (semiconducting) states. Exploiting this, we engineered asymmetric In2S3/Cu2(Se0.9S0.1) and In2S3/Cu2(Se0.9Te0.1) electrodes flanking a central In2S3/Cu2Se barrier. The asymmetric FTJ achieves a TER of 9.95×108%, which is 5 orders of magnitude higher than that of symmetric FTJs (1.28×103%), while maintaining an ultralow RAP of 0.11Ωµm2. Crucially, these optimal performance metrics (TER ∼109%, RAP<0.2Ωµm2) persist robustly even under variations in channel width (N=1 to N=9, ∼0.7–6.3nm) or electrode doping concentration (5%–15%). These findings highlight the superior performance and exceptional robustness of the asymmetric In2S3/Cu2Se-based FTJ, which holds significant promise for high-density, low-power, nonvolatile memory applications.

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