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    Identify the switching of VO3 and VO4 and its effect on ferroelectric hafnia

    Sida Li1,2, Zihe Wang2, Tingxiao Xie2, Chuang Xue2, Yufeng Xue2, Qian Yin2, Tongcai Yue2, Junwen Yin3, Tengfei Cao4 et al.

    Gilberto Teobaldi5, Qi Hu2,*, and Li-Min Liu2,†

    • *Contact author: huqi@buaa.edu.cn
    • †Contact author: liminliu@buaa.edu.cn

    Phys. Rev. B 113, 134109 – Published 13 April, 2026

    DOI: https://doi.org/10.1103/2j8c-3z3h

    Abstract

    HfO2 thin films are recognized as pivotal materials for next-generation ferroelectric memories, and extensive experimental efforts have been dedicated to defect-engineering HfO2-based systems towards tailored ferroelectric properties. However, the microscopic mechanisms through which excess electrons modulate the defect states and doping behavior in HfO2 remain not fully understood, which has slowed progress in the field. To fill this gap, we investigate the interaction mechanisms between aliovalent dopants and oxygen vacancies (VO) in HfO2 by subspace corrected (PBE+U functional) density functional theory simulations. Our results reveal that the extra charge introduced by trivalent dopants forms a small polaron localized on a tricoordinated oxygen atom, producing a deep empty defect state within the HfO2 band gap. This deep defect state can interact with the excess electrons generated by oxygen vacancies, thereby enhancing the stability of the three-coordinated oxygen vacancy (VO3) configuration compared to the four-coordinated one (VO4). The introduction of VO4 lowers the local polarization-switching barrier near a statistical accumulation of vacancies by 13%, while VO3 produces a more pronounced reduction of 60%, corresponding to a minimum barrier of 0.12eV/u.c. The stabilized VO3 center effectively reduces the ferroelectric switching barrier in the Pca21 phase by promoting reduced atomic displacements and lattice distortions, significantly decreasing the coercive field of HfO2. These findings provide critical insights for advancing the fundamental understanding of HfO2 materials and establishing design guidelines for constructing defect-tolerant ferroelectric devices through targeted defect engineering.

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