Chalcogenide halide ( = ; = ) monolayers as gate dielectrics for two-dimensional field-effect transistors
Phys. Rev. Applied 24, 034017 – Published 5 September, 2025
DOI: https://doi.org/10.1103/zm12-3qkz
Abstract
In recent years, rare-earth oxyhalides and transition-metal nitride halides have been reported as gate dielectrics in field-effect transistor (FET) applications. However, chalcogenide halides have been rarely explored as gate dielectrics. In this work, we systematically evaluated the potential of ( = ; = ) monolayers as replacements for hBN, focusing on their stability, electronic properties, dielectric properties, and leakage current through first-principles calculations. Based on analyses of stability and band gap, we identified five monolayers, namely ( = ), , and , which are easily exfoliable and exhibit both thermodynamic and dynamic stability, with large band gaps (>2.0 eV). These materials also exhibit favorable band offsets, high dielectric constants ( and ), high breakdown strength (0.99 – 1.54 MV/cm), and low leakage currents (< A ), indicating their potential as gate dielectric materials. Notably, the monolayer stands out as the most promising candidate among the five ScXY monolayers, owing to its highest breakdown strength (1.54 MV/cm), largest conduction band minimum (CBM) offset, and the lowest leakage current (< A ). Our study offers valuable insights into the development of chalcogenide halide gate dielectrics for next-generation electronic devices.