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    Efficient ohmic contact in monolayer Cu2Se field-effect transistors

    Jianqun Geng1,*, Lei Gao2,*,†, Xi Geng1, Hangjing Zhou1, Wuyi Gao1, Yuheng Zhang1, Qingyan Li1, Ruiping Duan1, Jianchen Lu1,‡ et al.

    Jinming Cai1,§

    • *These authors contributed equally to this work.
    • †Contact author: lgao@kust.edu.cn
    • ‡Contact author: jclu@kust.edu.cn
    • §Contact author: j.cai@kust.edu.cn

    Phys. Rev. Applied 24, 024027 – Published 12 August, 2025

    DOI: https://doi.org/10.1103/vqsp-81cc

    Abstract

    Experimentally fabricated semiconducting Cu2Se monolayers with a high electron mobility of approximately 103cm2V−1s−1 and exceptional environmental stability are promising for next-generation electronic device applications, such as field-effect transistors (FETs). However, the challenge of achieving Ohmic contacts with electrode metals persists. This study systematically investigates the interfacial properties of monolayer Cu2Se-based transistors with various common metals (Ti, Mo, Cr, W, Sb, Cu, Co, and Ni) as electrodes, leveraging first-principles calculations and quantum transport simulations. Our findings reveal that metal-induced gap states enable Cu2Se to form Ohmic contacts with all metal electrodes except Sb in the vertical direction. Furthermore, the absence of a tunneling barrier results in high carrier injection efficiency in the Cu2Se/Ti, /Mo, /Cr, and /W interfaces. The strong Fermi level pinning effects confine the Schottky barrier of Cu2Se/metal lateral contacts to a small value. Notably, Cu2Se/Mo and Cu2Se/Cu FETs demonstrate ideal Ohmic contacts in both vertical and lateral directions, with Mo electrodes exhibiting the highest contact quality in Cu2Se-based FETs. The transfer behaviors of the Cu2Se/Mo FETs nearly satisfy the standards in the International Technology Roadmap for Semiconductors for high-performance devices, aligning with the predicted quality of the electrode contacts. This work provides valuable theoretical guidance for the design of high-performance FETs utilizing Cu2Se.

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