Reuse & Permissions

It is not necessary to obtain permission to reuse this article or its components as it is available under the terms of the Creative Commons Attribution 4.0 International license. This license permits unrestricted use, distribution, and reproduction in any medium, provided attribution to the author(s) and the published article's title, journal citation, and DOI are maintained. Please note that some figures may have been included with permission from other third parties. It is your responsibility to obtain the proper permission from the rights holder directly for these figures.

Export citation

Export citation

Choose format for download:

Download Citation
  • Open Access

Order in disorder: Increased carrier mobility of downscaled amorphous semiconductors as exemplified by hydrogenated amorphous silicon

Yuezhou Luo* and Andrew John Flewitt

  • Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge CB3 0FA, United Kingdom

  • *Contact author: YL778@cantab.ac.uk

Phys. Rev. Applied 24, 054065 – Published 21 November, 2025

DOI: https://doi.org/10.1103/n66s-qw44

Abstract

Amorphous semiconductors are important channel semiconductors in thin-film transistors (TFTs), which serve not only active-matrix displays, but also flexible electronics for Internet of things applications. Nevertheless, a great limitation of amorphous semiconductors is their low carrier mobilities relative to their monocrystalline counterparts. Based on a recently established band-fluctuation framework [Y. Luo and A. Flewitt, Phys. Rev. B 109, 104203 (2024)], this paper shows that the intrinsic carrier mobility of amorphous semiconductors can significantly increase simply through device downscaling, without any material-level optimizations. Specifically, it is revealed that the intrinsic electron mobility of hydrogenated amorphous silicon in a 10-nm-long gap can increase by about 12 times, and this does not compromise device-to-device uniformity. This mobility improvement is a result of reduced localized band-tail states due to the ultrashort gap length relative to the band-fluctuation length scale before downscaling; the latter is determined by the short- and medium-range structural order of the amorphous semiconductor.

View figure in article

Physics Subject Headings (PhySH)

Article Text

References (46)

  1. D. Geng, K. Wang, L. Li, K. Myny, A. Nathan, J. Jang, Y. Kuo, and M. Liu, Thin-film transistors for large-area electronics, Nat. Electron. 6, 963 (2023).
  2. R. A. Street, Thin-film transistors, Adv. Mater. 21, 2007 (2009).
  3. K. Myny, The development of flexible integrated circuits based on thin-film transistors, Nat. Electron. 1, 30 (2018).
  4. A. Snell, K. Mackenzie, W. Spear, P. LeComber, and A. Hughes, Application of amorphous silicon field effect transistors in addressable liquid crystal display panels, Appl. Phys. A 24, 357 (1981).
  5. K. Nomura, H. Ohta, A. Takagi, T. Kamiya, M. Hirano, and H. Hosono, Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors, Nature 432, 488 (2004).
  6. H. Oh, J.-Y. Oh, C. W. Park, J.-E. Pi, J.-H. Yang, and C.-S. Hwang, High density integration of stretchable inorganic thin film transistors with excellent performance and reliability, Nat. Commun. 13, 4963 (2022).
  7. S.-H. Kang, J.-W. Jo, J. M. Lee, S. Moon, S. B. Shin, S. B. Choi, D. Byeon, J. Kim, M.-G. Kim, Y.-H. Kim, J.-W. Kim, and S. K. Park, Full integration of highly stretchable inorganic transistors and circuits within molecular-tailored elastic substrates on a large scale, Nat. Commun. 15, 2814 (2024).
  8. J. Biggs, J. Myers, J. Kufel, E. Ozer, S. Craske, A. Sou, C. Ramsdale, K. Williamson, R. Price, and S. White, A natively flexible 32-bit arm microprocessor, Nature 595, 532 (2021).
  9. E. Ozer, J. Kufel, J. Myers, J. Biggs, G. Brown, A. Rana, A. Sou, C. Ramsdale, and S. White, A hardwired machine learning processing engine fabricated with submicron metal-oxide thin-film transistors on a flexible substrate, Nat. Electron. 3, 419 (2020).
  10. W. Wang, K. Li, J. Lan, M. Shen, Z. Wang, X. Feng, H. Yu, K. Chen, J. Li, F. Zhou, L. Lin, P. Zhang, and Y. Li, CMOS backend-of-line compatible memory array and logic circuitries enabled by high performance atomic layer deposited ZnO thin-film transistor, Nat. Commun. 14, 6079 (2023).
  11. R. A. Street, Hydrogenated Amorphous Silicon (Cambridge University Press, New York, 1991).
  12. S. Yamamoto, J. N. J. Nakamura, and M. M. M. Migitaka, High-mobility thin-film transistor fabricated using hydrogenated amorphous silicon deposited by discharge of disilane, Jpn. J. Appl. Phys. 35, 3863 (1996).
  13. M. Brinza and G. Adriaenssens, Electronic properties of hydrogenated amorphous silicon prepared in expanding thermal plasmas, J. Optoelectron. Adv. Mater. 7, 73 (2005).
  14. M. Sakai, T. Tsutsumi, T. Yoshioka, A. Masuda, and H. Matsumura, High performance amorphous-silicon thin film transistors prepared by catalytic chemical vapor deposition with high deposition rate, Thin Solid Films 395, 330 (2001).
  15. H. Hosono, Ionic amorphous oxide semiconductors: Material design, carrier transport, and device application, J. Non-Cryst. Solids 352, 851 (2006).
  16. K. Nomura, A. Takagi, T. Kamiya, H. Ohta, M. Hirano, and H. Hosono, Amorphous oxide semiconductors for high-performance flexible thin-film transistors, Jpn. J. Appl. Phys. 45, 4303 (2006).
  17. H.-W. Zan, C.-C. Yeh, H.-F. Meng, C.-C. Tsai, and L.-H. Chen, Achieving high field-effect mobility in amorphous indium-gallium-zinc oxide by capping a strong reduction layer, Adv. Mater. 24, 3509 (2012).
  18. J.-L. Lin, W.-J. Sah, and S.-C. Lee, Amorphous-silicon thin-film transistors with very high field-effect mobility, IEEE Electron Device Lett. 12, 120 (1991).
  19. B. C. Lim, Y. J. Choi, J. H. Choi, and J. Jang, Hydrogenated amorphous silicon thin film transistor fabricated on plasma treated silicon nitride, IEEE Trans. Electron Devices 47, 367 (2000).
  20. H. Okada, Y. Uchida, and M. Matsumura, High-mobility amorphous-silicon MOS transistors, Jpn. J. Appl. Phys. 25, L718 (1986).
  21. L. Han, P. Mandlik, K. H. Cherenack, and S. Wagner, Amorphous silicon thin-film transistors with field-effect mobilities of 2 cm2/V s for electrons and 0.1 cm2/V s for holes, Appl. Phys. Lett. 94, 162105 (2009).
  22. E. Fortunato, L. Pereira, P. Barquinha, A. M. Botelho do Rego, G. Gonçalves, A. Vilà, J. R. Morante, and R. F. Martins, High mobility indium free amorphous oxide thin film transistors, Appl. Phys. Lett. 92, 222103 (2008).
  23. H. Chiang, J. Wager, R. Hoffman, J. Jeong, and D. A. Keszler, High mobility transparent thin-film transistors with amorphous zinc tin oxide channel layer, Appl. Phys. Lett. 86, 013503 (2005).
  24. M. Ando, M. Wakagi, and T. Minemura, Effects of back-channel etching on the performance of a-Si:H thin-film transistors, Jpn. J. Appl. Phys. 37, 3904 (1998).
  25. Y. Luo and A. Flewitt, Understanding localized states in the band tails of amorphous semiconductors exemplified by a-Si:H from the perspective of excess delocalized charges, Phys. Rev. B 109, 104203 (2024).
  26. M. Kim, J. H. Jeong, H. J. Lee, T. K. Ahn, H. S. Shin, J.-S. Park, J. K. Jeong, Y.-G. Mo, and H. D. Kim, High mobility bottom gate InGaZnO thin film transistors with SiOx etch stopper, Appl. Phys. Lett. 90, 212114 (2007).
  27. I. Song, S. Kim, H. Yin, C. J. Kim, J. Park, S. Kim, H. S. Choi, E. Lee, and Y. Park, Short channel characteristics of gallium–indium–zinc–oxide thin film transistors for three-dimensional stacking memory, IEEE Electron Device Lett. 29, 549 (2008).
  28. J. Guo, et al., A New Surface Potential and Physics Based Compact Model for a-IGZO TFTs at Multinanoscale for High Retention and Low-Power DRAM Application, in 2021 IEEE International Electron Devices Meeting (IEDM) (IEEE, 2021), pp. 8.5.1.
  29. D. J. Beesley, J. Semple, L. Krishnan Jagadamma, A. Amassian, M. A. McLachlan, T. D. Anthopoulos, and J. C. Demello, Sub-15 nm patterning of asymmetric metal electrodes and devices by adhesion lithography, Nat. Commun. 5, 3933 (2014).
  30. J. Semple, Dimitra G. Georgiadou, Gwenhivir Wyatt-Moon, Minho Yoon, Akmaral Seitkhan, Emre Yengel, Stephan Rossbauer, Francesca Bottacchi, Martyn A. McLachlan, Donal D. C. Bradley, and Thomas D. Anthopoulos, Large-area plastic nanogap electronics enabled by adhesion lithography, npj Flexible Electron. 2, 1 (2018).
  31. G. Wyatt-Moon, K. Niang, C. Rider, and A. Flewitt, Air stable indium-gallium-zinc-oxide diodes with a 6.4 GHz extrinsic cutoff frequency fabricated using adhesion lithography, IEEE Electron Device Lett. 41, 175 (2019).
  32. G. Wyatt-Moon, G. Saravanavel, S. Sambandan, and A. Flewitt, Nanodiodes on a digestible substrate, IEEE Electron Device Lett. 44, 337 (2022).
  33. M. Zeman, Advanced amorphous silicon solar cell technologies, in Thin Film Solar Cells: Fabrication, Characterization and Applications, edited by J. Poortmans and V. Arkhipov (John Wiley & Sons, Ltd., West Sussex, England, 2006), pp. 173.
  34. Y. Luo and A. Flewitt, Revisiting multiple trapping and release charge transport in amorphous semiconductors exemplified by hydrogenated amorphous silicon, J. Non-Cryst. Solids 654, 123436 (2025).
  35. A. Einstein, On the motion of small particles suspended in liquids at rest required by the molecular-kinetic theory of heat, Ann. Phys. 17, 208 (1905).
  36. P. Le Comber and W. Spear, Electronic transport in amorphous silicon films, Phys. Rev. Lett. 25, 509 (1970).
  37. G. Juška, K. Arlauskas, J. Kočka, M. Hoheisel, and P. Chabloz, Hot electrons in amorphous silicon, Phys. Rev. Lett. 75, 2984 (1995).
  38. X. Wang and A. Dodabalapur, Carrier velocity in amorphous metal–oxide–semiconductor transistors, IEEE Trans. Electron Devices 68, 125 (2020).
  39. J. Chévrier and B. Equer, High electric-field amorphous silicon p-i-n diodes: Effect of the p-layer thickness, J. Appl. Phys. 76, 7415 (1994).
  40. K. Sawada, C. Mochizuki, S. Akata, and T. Ando, Photocurrent multiplication in hydrogenated amorphous silicon p-i-n photodiode films, Appl. Phys. Lett. 65, 1364 (1994).
  41. S. Matsuda, et al., 30-nm-channel-length c-axis aligned crystalline In-Ga-Zn-O transistors with low off-state leakage current and steep subthreshold characteristics, in 2015 Symposium on VLSI Technology (VLSI) (IEEE, 2015), pp. T216.
  42. K. Chen, et al., Scaling Dual-Gate Ultra-thin a-IGZO FET to 30 nm Channel Length with Record-high Gm,max of 559 μS/μm at VDS=1 V, Record-low DIBL of 10 mV/V and Nearly Ideal SS of 63 mV/dec, in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI) (IEEE, 2022), pp. 298.
  43. S. Subhechha, et al., First demonstration of sub-12 nm Lg gate last IGZO-TFTs with oxygen tunnel architecture for front gate devices, in 2021 Symposium on VLSI Technology (IEEE, 2021), pp. 1.
  44. S. Samanta, K. Han, C. Sun, C. Wang, A. Kumar, A. V.-Y. Thean, and X. Gong, Amorphous InGaZnO thin-film transistors with sub-10-nm channel thickness and ultrascaled channel length, IEEE Trans. Electron Devices 68, 1050 (2021).
  45. Y. Luo, University of Cambridge Repository (2025), https://doi.org/10.17863/CAM.122621.
  46. Flatiron Institute Fast Multipole Libraries, https://github.com/flatironinstitute/FMM3D (Accessed August 2023).

Outline

Information

Sign In to Your Journals Account

Filter

Filter

Article Lookup

Enter a citation