- Open Access
Performance Modeling of Tandem Photovoltaics: A Yearlong Outdoor Degradation Analysis of a // Minimodule
PRX Energy 5, 023014 – Published 18 June, 2026
DOI: https://doi.org/10.1103/cmw1-vsbd
Abstract
We present a performance modeling and degradation analysis framework for tandem photovoltaic modules, building upon established procedures for crystalline silicon devices and adapting them to account for the spectral sensitivity of multijunction technologies. The methodology employs filter criteria to select outdoor measurements close to standard test conditions (STC) under stable spectral and ambient conditions, followed by normalization of power production data with corrections for temperature, irradiance, and precipitable water vapor. We demonstrate this framework using a mechanically stacked four-terminal gallium arsenide () // silicon () tandem solar minimodule deployed outdoors from October 2019 to January 2021 in Golden, Colorado, USA. We determined degradation rates of year for the subcell and year for the subcell, with analysis of individual performance metrics indicating that packaging degradation, particularly delamination, was the dominant failure mode. Simulations using PVcircuit, an open-source equivalent-circuit solver, confirmed these findings. The presented methodology provides a reproducible foundation for performance modeling and degradation analysis of emerging tandem technologies.
Physics Subject Headings (PhySH)
Popular Summary
Tandem solar cells stack two absorbing layers to capture more of the solar spectrum than conventional single-junction solar cells. However, no standardized method currently exists to evaluate how quickly these devices degrade under real outdoor conditions. Here, the authors developed a systematic framework that filters field measurements for stable atmospheric conditions and corrects for variations in temperature, irradiance, and spectral content. They applied this method to a gallium arsenide/silicon tandem mini-module deployed outdoors in Colorado for 14 months. The analysis reveals that the dominant source of performance loss was degradation of the module packaging, specifically delamination, rather than the semiconductor cells themselves. Circuit-level simulations independently confirmed this conclusion. These results demonstrate that reliable packaging is as critical as cell efficiency for emerging tandem technologies. The freely available methodology provides a reproducible foundation for outdoor performance evaluation of any tandem architecture, supporting the durability assessments needed for commercial deployment.
Article Text
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