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    Deployable Nanoelectromechanical Bound States in the Continuum in GHz Lamb Wave Phononic Crystals on LiNbO3 Thin Films

    Sheng-Nan Liang1,*, Zhen-Hui Qin1,*, Shu-Mao Wu1, Hua-Yang Chen1, Si-Yuan Yu1,2,3,†, and Yan-Feng Chen1,2,3,‡

    • 1National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China
    • 2Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China
    • 3Jiangsu Key Laboratory of Artificial Functional Materials, Nanjing University, Nanjing, 210093, China

    • *These authors contributed equally to this work.
    • †Contact author: yusiyuan@nju.edu.cn
    • ‡Contact author: yfchen@nju.edu.cn

    Phys. Rev. Lett. 135, 206201 – Published 12 November, 2025

    DOI: https://doi.org/10.1103/t9fk-pb3w

    Abstract

    Bound states in the continuum (BICs) are a fascinating class of eigenstates that trap energy within the continuum, enabling breakthroughs in ultra-low-threshold lasing, high-Q sensing, and advanced wave-matter interactions. However, their stringent symmetry requirements hinder practical integration, especially in acoustic and electromechanical systems where efficient mode excitation is challenging. Here, we demonstrate deployable nanoelectromechanical quasi-BICs on suspended lithium niobate thin films, enabled by nanoscale Lamb wave phononic crystals operating at gigahertz frequencies. By exploiting the decoupling of symmetric (S) and antisymmetric (A) Lamb wave modes, we create a robust framework for BICs. Controlled mirror symmetry breaking induces targeted coupling between the S and A modes, resulting in quasi-BICs that preserve high-Q characteristics and can be excited by traveling waves, eliminating the need for specialized excitation schemes. Our approach enables the multiplexing of quasi-BIC resonators along a single transmission line, each corresponding to a unique frequency and spatial position. This Letter presents a scalable route for the on-chip integration of BICs, bridging the gap between theoretical concepts and practical nanoelectromechanical devices, and opening new avenues in advanced signal processing, high-precision sensing, and quantum acoustics.

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