Buried Pd slows self-diffusion on Cu(001)

E. Bussmann, I. Ermanoski, P. J. Feibelman, N. C. Bartelt, and G. L. Kellogg
Phys. Rev. B 84, 245440 – Published 21 December 2011

Abstract

Using low-energy electron microscopy, we determine that self-diffusion of the Cu(001) surface is slowed by the presence of a c(2×2)-Pd buried surface alloy. We probe surface diffusion using Cu-adatom island-ripening measurements. On alloyed surfaces, the island decay rate decreases monotonically as the Pd concentration is increased up to 0.5 monolayer (ML), where the 2×2 buried alloy is Pd saturated. We propose that the Pd slows island ripening by inhibiting the diffusion of surface vacancies across terraces. For dilute alloys (0.2-ML Pd), this conclusion is supported by density-functional theory calculations, which show that surface vacancies migrate more slowly owing to an attraction to isolated buried Pd atoms. The results illustrate a fundamental mechanism by which even a dilute alloy thin-film coating may act to inhibit surface-diffusion-mediated processes, such as electromigration.

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  • Received 11 January 2011

DOI:https://doi.org/10.1103/PhysRevB.84.245440

©2011 American Physical Society

Authors & Affiliations

E. Bussmann1,*, I. Ermanoski1, P. J. Feibelman1, N. C. Bartelt2, and G. L. Kellogg1

  • 1Sandia National Laboratories, Albuquerque, New Mexico 87185, USA
  • 2Sandia National Laboratories, Livermore, California 94551, USA

  • *ebussma@sandia.gov

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Vol. 84, Iss. 24 — 15 December 2011

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